TIER IV joins imec’s Automotive Chiplet Program to align its open source Autoware stack with emerging chiplet-based semiconductor architectures, aiming to accelerate scalable AI-driven software-defined vehicles.
TIER IV has joined the imec Automotive Chiplet Program (ACP), marking a major push to align open-source autonomous driving software with next-generation semiconductor architectures for software-defined vehicles (SDVs).
The collaboration centres on integrating Autoware, developed by TIER IV, with emerging chiplet-based architectures and specialised AI accelerators. The goal is to ensure that open-source mobility software can run efficiently across diverse silicon platforms while supporting open standards across the automotive ecosystem.
Chiplet technology combines specialised semiconductor components into modular systems, enabling automakers to optimise performance while avoiding dependence on a single proprietary hardware vendor. Through the ACP initiative, TIER IV will contribute to the development of interoperable chiplet standards designed for automotive-grade systems.
“Our strategy is built on the principle that autonomous driving should be adaptable to any platform and any use case,” said Shinpei Kato. “Joining imec’s ACP allows us to harmonize open-source software with silicon based on open standards. Regardless of the underlying computing architecture, our goal is to ensure that Autoware and our AI-based models deliver peak performance through optimized chiplet designs.”
The company’s approach is structured around a multi-environment and multi-application strategy, ensuring compatibility across automaker platforms, sensors, and system-on-chips while supporting deployments ranging from embedded vehicle systems to reference designs and mobility services.
TIER IV has already completed development of a LiDAR accelerator for high-speed 3D point-cloud processing and is now focusing on AI accelerators tailored for neural-network-driven autonomous driving workloads.
“We’re delighted to welcome TIER IV to imec’s ACP,” said Bart Placke. “Together, we aim to accelerate the maturation of chiplet-based architectures that will underpin the next generation of safe, reliable, scalable and energy-efficient autonomous mobility.”
